Strong cutting force, effective removal of burrs, no chipping, no hole plugging.
Replace the traditional abrasive belt, and the copper surface is even and not scratched.
Special bonding resin, the ink resin will not stick to the grinding process, and the grinding force is stable.
The mirror surface treatment effect effectively removes the glue overflow from the pressing and reduces the steel plate outsourcing and re-grinding.
Quickly reduce copper and maintain uniform copper thickness to improve yield.
Lightweight stone, reduce machine load, improve heat dissipation, and avoid thermal scratches (cloud-like brush marks) on the grinding surface.
Optimize the ratio of bonding agent, extremely long grinding life performance.