With the unique differential grinding method in the industry, the substrate with uneven copper surface after electroplating is smoothly transformed into an excellent substrate with minimal copper thickness difference, and the size of the substrate is not limited, which can meet the demand for mass production in the factory.
The excellent surface copper thickness uniformity means that the circuit yield of high-end substrates is greatly improved, and it also affects the development direction of subsequent ultra-fine circuits. Moreover, the HGT solution has an absolute advantage over the production cost of the chemical process.