HGT-421 Small Automatic Substrate Grinding Machine
Mini scale Grinder for IC package and Ceramic substrate
Scope of application:
All kinds of lead frame package overflow glue to remove de-flash.
After the lead frame is encapsulated, the residual adhesive of the tape is removed to remove the residue.
After the lead frame is packaged, the copper surface is activated before electroplating.
Molding Compound/EMC is thinner after packaging.
Molding Compound/EMC grinding and exposed die after packaging.
Molding deflash overflow glue removal
de-tapping residue remove
Thinning of ceramic substrates (ALN, ALO, Sapphire).
Laser slag removal on ceramic substrates.
After the ceramic substrate is electroplated, the copper surface is leveled and thinned.
The ceramic substrate solder resist is removed and leveled.
The silver plug hole of the ceramic substrate is ground and leveled.
All kinds of substrates are specially polished.
Other special grinding.
Ceramic substrate grinding
Small-scale economy grinding solution
High UPH performance up to 320 Strips
The high performance of quality and efficiency
No de-lam problem.
No Crack or break.
Product Width ➠60~150mm
Process Speed ➠up to 3 m/min
F unction A ➠Ceramic substrate
Glass substrate, ALN substrate, etc.
F unction B ➠QFN / DFN / IPM / PPAK / MIS / Premold lead frame / Exposed clip / Any kind of LeadFrame package is able to experience grinding de-flash process.